Thanks to generous support from the U.S. National Science Foundation (NSF) and other sponsors, IEEE BIBM 2026 will offer approximately 60 Student Travel Awards, with each award providing up to US$800 in travel support.
All student authors of accepted IEEE BIBM 2026 papers are eligible to apply, provided that they attend and participate in the conference in person and have completed conference registration. The travel award does not apply to authors participating in the Undergraduate and High School Symposium, for which a separate registration discount is already provided.
Applicants should submit their name, affiliation, paper ID and title, a supporting letter from their advisor or department chair, and conference registration receipt through the following application form:
Student Travel Award Application:
https://stonybrookuniversity.co1.qualtrics.com/jfe/form/SV_eEsTsTQocoodaGW
Application Deadline: November 8, 2026
Award recipients are expected to participate actively in IEEE BIBM 2026 and provide a limited amount of volunteer support to the conference, such as helping with registration, session support, attendee guidance, or other conference activities coordinated by the organizers.
Prof. Tengfei Ma
Stony Brook University
Email: tengfei.ma@stonybrookmedicine.edu
We look forward to welcoming student authors to IEEE BIBM 2026 in Dallas, Texas, December 1‑4, 2026.